关键词: 功率模块, 铜基板, 预翘曲, 有限元仿真

Abstract: During power module installation applications, the flatness of copper baseplate is critical to the module's thermal performance and reliability. By constructing finite element models of power modules to complement warpage experiments, analyzing warpage data during the manufacturing process for copper substrates with varying pre-warpage levels, investigating the effect of pre-warpage on the final warpage of power modules after encapsulation. In the power module manufacturing process, the first-time welding process has the most significant effect on warpage, with its effect increasing as the pre-warpage height rises. The secondary welding, housing assembly, and silicone gel curing processes have a weak effect on warpage and aligned with simulation results. By combining finite element simulation with analysis method from warpage experiments during the first-time welding process, warpage in copper baseplates throughout the entire manufacturing process can be predicted. This provides crucial guidance for designing pre-warpage copper baseplates in industrial manufacturing.

Key words: power module, copper baseplate, pre-warpage, finite element simulation