高密度集成SiP的跨尺度建模方法研究
张劭春，刘宁，张景辉，朱旻琦，冯凯晨，杨凝，洪力，李霄，孙晓冬，汪志强
Multi-Scale Modeling Methods for High-Density Integrated SiP Modules
ZHANG Shaochun,LIU Ning,ZHANG Jinghui,ZHU Minqi,FENG Kaichen,YANG Ning,HONG Li,LI Xiao,SUN Xiaodong, WANG Zhiqiang
电子与封装
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2026, (2): 0
-020205
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DOI: 10.16257/j.cnki.1681-1070.2026.0022
