关键词: 系统级封装, 跨尺度, 等效模型, 数值模拟

Abstract: To address the multi-scale modeling challenges posed by complex micro-structures in high-density system in package (SiP), a homogenization-based equivalence method is employed to transform the microstructures into a macroscopic homogeneous model. By theoretically deriving the equivalent thermal conductivity, a multi-scale thermal model is established. The simplified model reduces the mesh count by 77.1%, improves simulation efficiency to 317.7%, and introduces less than 2% error. A hierarchical electromagnetic model spanning micro components, SiP, sockets, and the PCB is constructed to simulate signal interference across different levels. To overcome the computational complexity of detailed interconnect structures, model simplification strategies are applied. Based on the hierarchical model, impedance discontinuities in vertical transition structures of high-speed SerDes signals are identified and resolved. As a result, the impedance is improved from 71.9 - 81.9 Ω to 88.1 - 96.1 Ω.

Key words: system in package, multi-scale, equivalent model, numerical simulation