芯片级大面积低温铜烧结互连性能研究
陈振明1, 闫海东2, 章永飞3, 李万里1
Research on Chip-Level Large-Area Low-Temperature Copper Sintering Interconnect Performance
CHEN Zhenming1, YAN Haidong2, ZHANG Yongfei3, LI Wanli1
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2026.0113
