关键词: 低温铜烧结, 大面积互连, 有机物排出

Abstract: To address issues such as high organic residue and insufficient densification in low-temperature copper sintering for large-area chip packaging, a 'pre-drying——rapid pressure sintering' process was proposed, achieving an effective separation between organic decomposition and expulsion and the sintering densification process. By optimizing the sintering temperature and pressure, a dense and uniform sintered structure can be obtained at low temperatures. Morphological analysis shows that the porosity difference between the center and the edges of the sintered copper is small, with good interface bonding. Thermal resistance tests indicate that IGBT chips connected using the copper sintering process have a junction-to-case thermal resistance lower than that of the control group using silver sintering under low-temperature sintering conditions. The experimental results confirm the mechanical and thermal advantages of low-temperature large-area copper sintering, providing a feasible technical path for highly reliable and cost-effective packaging of large-area chips.

Key words: low-temperature copper sintering, large-area interconnection, organic matter emission