用于热管理与电磁屏蔽的聚合物基电子封装材料
姜泽沛1, 董曼琪1, 荣耀辉1, 宫毛高1, 夏俊生2, 曹亮1
Polymer-Based Electronic Packaging Materials
for Thermal Management and Electromagnetic Shielding
JIANG Zepei1, DONG Manqi1, RONG Yaohui1, GONG Maogao1, XIA Junsheng2, CAO Liang1
电子与封装
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0, (): 0
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DOI: 10.16257/j.cnki.1681-1070.2026.0118
