关键词: 聚合物基电子封装材料, 热界面材料, 电磁屏蔽材料

Abstract: As integrated circuits advance into the post-Moore era, the relentless increase in chip power density and signal frequency has made heat accumulation and electromagnetic interference (EMI) the primary bottlenecks limiting system performance and reliability. Consequently, polymer-based electronic packaging materials, valued for their lightweight nature, ease of processing, low cost, and excellent electrical insulation, have emerged as a critical platform for developing efficient thermal management and EMI shielding solutions. This review systematically summarizes recent progress and challenges in these materials, focusing on thermal interface materials (TIMs) and EMI shields. It analyzes the heat transfer mechanisms in TIMs and outlines advanced strategies—such as filler blending, oriented alignment, and three-dimensional structural design (e.g., via external field induction or templating methods)—to enhance thermal conductivity. For EMI shielding materials, the fundamental mechanisms of absorption, reflection, and multiple reflections are elucidated. The review further examines effective pathways for achieving high-absorption, low-reflection "green" shielding, incorporating magnetic fillers (e.g., ferrites, MXene composites) and sophisticated microstructural designs like gradient architectures and porous networks.

Key words: polymer-based electronic packaging materials, thermal interface materials,  electromagnetic interference shielding materials