中国电子学会电子制造与封装技术分会会刊

中国半导体行业协会封测分会会刊

无锡市集成电路学会会刊

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功率器件烧结银互连组织演化及性能影响研究进展

郭志濠, 魏雨晨, 钟志宏, 梁水保
Research Advances on the Evolution and Performance Impact of Sintered Silver Interconnect Structures in Power Devices#br#
GUO Zhihao, WEI Yuchen, ZHONG Zhihong, LIANG Shuibao
电子与封装 . 0, (): 0 -0 .  DOI: 10.16257/j.cnki.1681-1070.2026.0129