关键词: 功率器件封装, 固晶互连, 烧结银, 多孔结构, 形貌演化, 热-力性能

Abstract: The escalating power density of wide bandgap semiconductor devices, coupled with the stringent demand for stable operation in high-temperature environments, has imposed increasingly rigorous requirements on packaging interconnect materials. Sintered silver, characterized by its unique "low-temperature sintering and high-temperature service" capability and superior electrical/thermal performance, has emerged as an ideal die-attach material for high-reliability interconnects in power devices. However, the inherently porous microstructure of sintered silver undergoes significant morphological evolution during service, which profoundly impacts its thermo-mechanical properties and long-term reliability. This paper systematically reviews the evolution of sintered silver micro-morphology under service conditions, focusing on the driving mechanisms of pore coarsening, grain growth, and porosity changes. Furthermore, the influence of microstructural evolution on thermal conductivity, mechanical properties, and interfacial bonding strength is revealed, and the underlying interconnect failure mechanisms are analyzed. By synthesizing recent research progress, this work provides a theoretical reference for optimizing the microstructural design of sintered silver interconnects and enhancing the service reliability of power electronics.

Key words: power device packaging, die attach interconnect, sintered silver, porous structures, morphology evolution, thermo-mechanical properties