B2O3/RO对芯片封装用无碱铝硼硅玻璃基板结构和性能的影响
张兴治1, 2, 赵志永1, 2, 刘亚茹3, 刘正1, 2, 李佳昊1, 2, 田英良1, 2
Effect of B2O3/RO Ratio on
Structure and Performance of Alkali-Free Aluminoborosilicate Glass Substrates
for Chip Packaging
ZHANG Xingzhi1, 2, ZHAO Zhiyong1, 2, LIU Yaru3, LIU Zheng1, 2, LI Jiahao1, 2, TIAN Yingliang1, 2
电子与封装
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0, (): 0
-0
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DOI: 10.16257/j.cnki.1681-1070.2026.0130
