面向异质异构集成的光控解键合技术研究进展
岳聚民1, 2, 王方成1, 2, 孙蓉1, 2, 张国平1, 2, 刘强1, 2
Research Progress on Light-Controlled Debonding
Technology for Heterogeneous Integration
YUE Jumin1, 2, WANG Fangcheng1, 2, SUN Rong1, 2, ZHANG Guoping1, 2, LIU Qiang1, 2
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2026.0132
