关键词: 临时键合, 光控解键合, 异质异构集成, 发展趋势

Abstract: As Moore's Law gradually slows, heterogeneous integration has emerged as a critical pathway for sustaining system performance improvements and achieving functional diversification. Advanced packaging technologies such as 2.5D/3D integration and wafer-level packaging necessitate ultra-thin chip processing, where temporary bonding and debonding processes directly influence the yield and reliability of integrated systems. In recent years, light-controlled debonding technologies have attracted considerable interest due to their advantages of non-contact operation, low stress, and spatially controllable energy delivery. This paper systematically reviews the fundamental principles, material systems, and process characteristics of three mainstream light-controlled debonding approaches: laser debonding, photonic debonding, and reversible debonding. Recent research advancements are summarized, and a comprehensive comparison is presented with respect to energy control mechanisms, thermal effects, and process compatibility. Finally, the technical challenges and future development trends are discussed, aiming to provide guidance for the selection of advanced packaging processes in high-performance heterogeneous integrated systems.

Key words: temporary bonding, light-controlled debonding, heterogeneous integration, development trend