集成电路三维封装力学仿真方法综述*
王凤娟, 马丁, 孙传鸿, 尹湘坤, 杨媛, 余宁梅, 余明斌, 李言
Review of Mechanical Simulation Methods for 3D Integrated Circuit Packaging
WANG Fengjuan, MA Ding, SUN Chuanhong, YIN Xiangkun, YANG Yuan, YU Ningmei, YU Mingbin, LI Yan
电子与封装
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2026, (3): 30009
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DOI: 10.16257/j.cnki.1681-1070.2026.0108
