塑封材料特性对SiC扇出型板级封装热-机械行为的影响研究*
吴奥洲, 李雯钰, 杜伟, 陈俊伟, 佘乃东, 宋关强, 樊嘉杰
Study on the Effect of Encapsulation Material Properties on the Thermo-Mechanical Behavior of SiC Fan-Out Panel-Level Packaging
WU Aozhou, LI Wenyu, DU Wei, CHEN Junwei, SHE Naidong, SONG Guanqiang, FAN Jiajie
电子与封装
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2026, (3): 30010
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DOI: 10.16257/j.cnki.1681-1070.2026.0112
