塑封材料特性对SiC扇出型板级封装热-机械行为的影响研究*

doi:10.16257/j.cnki.1681-1070.2026.0112

摘要/Abstract

摘要： SiC器件的高功率密度与封装微型化趋势，使得环氧塑封料（EMC）的热-机械性能成为决定器件性能与可靠性的关键因素。在先进的扇出型板级封装（FOPLP）中，这一挑战尤为突出，因为EMC不仅承担绝缘任务，更是结构机械支撑与阻碍散热的主体。为探究不同EMC对FOPLP热-机械性能的具体影响规律，以2种不同填料体系的商用EMC为研究对象，系统表征了其关键热-机械物性，随后通过热阻与热翘曲实验，揭示了材料差异对封装性能变化的影响。同时，建立了FOPLP结构的热-机械耦合有限元（FEA）仿真模型，进行仿真验证，分析了不同EMC对封装性能的最终影响，并验证了所构建的FEA仿真模型的准确性。研究结果表明Al₂O₃填充EMC在热阻与热翘曲方面优于SiO₂填充EMC，所构建的FEA模型能高精度地预测封装的热机械行为，证实了此实验-仿真综合评估方法的有效性。

关键词: SiC扇出型板级封装, 环氧塑封料, 热-机械性能, 热阻, 翘曲

Abstract: The high power density and miniaturization trend of SiC devices make the thermo-mechanical properties of epoxy molding compound (EMC) a critical factor determining device performance and reliability. This challenge is particularly pronounced in advanced fan-out panel-level packaging (FOPLP) designs, where the EMC not only serves as insulation but also functions as the primary structural support and a barrier to heat dissipation. To investigate the specific influence patterns of different EMCs on the thermo-mechanical properties of FOPLP, two commercially available EMC systems with distinct filler compositions are selected as research subjects. Their key thermo-mechanical properties are systematically characterized. Subsequently, thermal resistance and thermal warpage experiments are conducted to reveal how material variations affect changes in packaging performance. Simultaneously, a thermo-mechanically coupled finite element analysis (FEA) simulation model of the FOPLP structure is established for simulation validation. The final impact of different EMC types on packaging performance is analyzed, and the accuracy of the constructed FEA simulation model is validated. The research findings demonstrate that the Al₂O₃-filled EMC exhibits superior thermal resistance and thermal warpage characteristics compared to the SiO₂-filled EMC. The constructed FEA model accurately predicts the thermo-mechanical behavior of the package, validating the effectiveness of this integrated experiment-simulation evaluation approach.

Key words: SiC fan-out panel-level packaging, epoxy molding compound, thermo-mechanical properties, thermal resistance, warpage

中图分类号:

TN305.94

吴奥洲, 李雯钰, 杜伟, 陈俊伟, 佘乃东, 宋关强, 樊嘉杰. 塑封材料特性对SiC扇出型板级封装热-机械行为的影响研究^*[J]. 电子与封装, 2026, 26(3): 030010 .

WU Aozhou, LI Wenyu, DU Wei, CHEN Junwei, SHE Naidong, SONG Guanqiang, FAN Jiajie. Study on the Effect of Encapsulation Material Properties on the Thermo-Mechanical Behavior of SiC Fan-Out Panel-Level Packaging[J]. Electronics & Packaging, 2026, 26(3): 030010 .

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中国电子学会电子制造与封装技术分会会刊

中国半导体行业协会封测分会会刊

无锡市集成电路学会会刊

塑封材料特性对SiC扇出型板级封装热-机械行为的影响研究^*

Study on the Effect of Encapsulation Material Properties on the Thermo-Mechanical Behavior of SiC Fan-Out Panel-Level Packaging

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