面向结温和应力降低的SiC功率模块封装结构协同优化设计
李轩, 李明阳, 陈朝兴, 温瑞康, 韩久鹏, 邓小川, 张波
Collaborative Optimization Design of Packaging
Structure for SiC Power Module Aiming at Junction Temperature and Stress
Reduction
LI Xuan, LI Mingyang, CHEN Chaoxing, HAN Jiupeng, Wen Ruikang, Deng Xiaochuan, Zhang Bo
电子与封装
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0, (): 0
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DOI: 10.16257/j.cnki.1681-1070.2026.0138
