关键词: SiC功率模块, 封装, 多物理场, 有限元仿真, 多目标优化, 响应面法, 粒子群算法

Abstract: Addressing the electro-thermal-mechanical multi-physics coupling characteristics during the operation of silicon carbide (SiC) power modules, the optimization of their packaging structure often faces the challenge of trade-offs between junction temperature and stress, where optimizing a single indicator typically leads to the deterioration of the other. To this end, a collaborative optimization design study of the packaging structure based on key thickness parameters was conducted. Firstly, through electro-thermal-mechanical finite element analysis, the temperature and stress distribution of the CAS120M12BM2 power module under specified operating conditions were obtained. Secondly, the Response Surface Methodology was employed to systematically analyze the influence of three structural parameters—the thickness of the direct bond copper (DBC) ceramic layer, the chip solder layer thickness, and the DBC solder layer thickness—on junction temperature and stress. Finally, the Particle Swarm Optimization algorithm was introduced for multi-objective collaborative optimization of these three parameters. By modifying these structural parameters, the goal was to simultaneously reduce the maximum junction temperature and the maximum equivalent stress of the power module under the same operating conditions. The results indicate that, compared with the CAS120M12BM2 prototype under the same operating conditions, with the maximum chip junction temperature basically unchanged, the maximum equivalent stress is reduced by 13.65% for the optimized packaging structure, effectively overcoming the limitations of single-objective optimization. This research offers certain guiding significance for the multi-physics collaborative design of SiC power modules.

Key words: SiC power module, packaging, multi-physics field, finite element simulation, multi-objective optimization, response surface methodology,  particle swarm optimization