高性能封装玻璃基板TGV技术的研究现状、挑战与未来展望
赵强1, 张继华2
Research Progress, Challenges, and Future
Prospects of Through Glass Via Technology for High-Performance Advanced
Packaging
ZHAO Qiang1, ZHANG Jihua2
电子与封装
.
0, (): 0
-0
.
DOI: 10.16257/j.cnki.1681-1070.2026.0139
