关键词: 玻璃基板, 玻璃通孔, 激光诱导深度刻蚀, 先进封装, 异构集成

Abstract: With the deceleration of Moore's Law, advanced packaging technologies represented by heterogeneous integration and system-in-package have become strategic high grounds in the post-Moore era. Glass substrates, by virtue of their excellent flatness, low dielectric loss, and tunable coefficient of thermal expansion, are regarded as ideal media for breaking through packaging bottlenecks in high-performance computing and artificial intelligence chips. Through a systematic review of the research status of through glass via (TGV) technology, the mechanisms, advantages, and disadvantages of core via-formation processes such as laser-induced deep etching and photosensitive glass etching are analyzed, and the research progress in metallization filling of high-aspect-ratio vias and redistribution layer reliability is evaluated. Addressing key challenges such as micro-crack control and thermal stress mismatch caused by glass brittleness, existing solutions are summarized. Furthermore, combined with domestic and international industrial chain dynamics, the trend of TGV technology evolving toward large-scale panel-level packaging is elaborated, providing a reference for the research and development of next-generation high-performance electronic packaging substrates.

Key words: glass substrate, through glass via, laser-induced deep etching, advanced packaging, heterogeneous integration