功率器件封装中电沉积铜阵列形貌与应用的研究
张艺豪, 张景辉, 王奉祎, 江贤达, 陈宏涛
Morphology and Application of Electrodeposited
Copper Arrays in Power Device Packaging
ZHANG Yihao, ZHANG Jinghui, WANG Fengyi, JIANG Xianda, CHEN Hongtao
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2026.0140
