关键词: 铜阵列, 电沉积, 电沉积条件, 剪切强度

Abstract: To improve the low-temperature bonding quality at the Cu-Cu direct bonding interface in power device packaging, Cu arrays with different morphologies were prepared using a dual-continuous microemulsion electrodeposition method. The effects of deposition voltage and Cu salt concentration on the array morphology and bonding performance were investigated. The results indicate that as the deposition voltage or Cu salt concentration increases, the Cu deposition morphology gradually evolves from a continuous thin layer to granular, columnar agglomerates, and dendritic structures, with surface roughness and porosity characteristics increasing in tandem. The bonding strength is primarily governed by the combined effects of pore connectivity, interfacial continuity, and the degree of structural interlocking. Under conditions of 260 ℃, 10 MPa, and 15 min, the columnar agglomerate array exhibited good interfacial continuity and significant compaction interlocking, resulting in the highest strength (30.2 MPa); the granular array was prone to forming interconnected unbonded zones, resulting in the lowest strength (12.1 MPa); the dendritic array, constrained by high porosity and localized low-density zones, exhibited moderate strength (26.4 MPa).

Key words: copper array, electrodeposition, electrodeposition conditions, shear strength