高流量声流控芯片的异质集成键合研究
曹昌铭1, 2, 3, 冉康1, 李亚飞1, 鲍天宇1, 2, 3, 袁梓耀1, 2, 3, 李琰1, 叶素2, 3, 刘威2, 安荣1, 2, 3
Heterogeneous Integration Bonding of High-Throughput Acoustofluidic Chips
CAO Changming1, 2, 3, RAN Kang1, LI Yafei1, BAO Tianyu1, 2, 3, YUAN Ziyao1, 2, 3, LI Yan1, YE Su2, 3, LIU Wei2, AN Rong1, 2, 3
电子与封装
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0, (): 0
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DOI: 10.16257/j.cnki.1681-1070.2026.0144
