中国电子学会电子制造与封装技术分会会刊

中国半导体行业协会封测分会会刊

无锡市集成电路学会会刊

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电子与封装

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高流量声流控芯片的异质集成键合研究

曹昌铭1,2,3,冉康1,李亚飞1,鲍天宇1,2,3,袁梓耀1,2,3,李琰1,叶素2,3,刘威2,安荣1,2,3   

  1. 1. 哈尔滨工业大学医学与健康学院,哈尔滨  150001;2. 哈尔滨工业大学材料结构精密焊接与连接全国重点实验室,哈尔滨  150001;3. 哈尔滨工业大学微系统与微结构制造教育部重点实验室,哈尔滨  150080
  • 收稿日期:2026-02-28 修回日期:2026-04-23 出版日期:2026-04-27 发布日期:2026-04-27

Heterogeneous Integration Bonding of High-Throughput Acoustofluidic Chips

CAO Changming1,2,3, RAN Kang1, LI Yafei1, BAO Tianyu1,2,3, YUAN Ziyao1,2,3, LI Yan1, YE Su2,3, LIU Wei2, AN Rong1,2,3   

  1. 1. School of Medicine and Health, Harbin Institute of Technology, Harbin 150001, China; 2. National Key Laboratory of Precision Welding & Joining of Materials and Structures, Harbin Institute of Technology, Harbin 150001, China; 3. Key Laboratory of Micro-Systems and Micro-Structures Manufacturing of Ministry of Education, Harbin Institute of Technology, Harbin 150080, China
  • Received:2026-02-28 Revised:2026-04-23 Online:2026-04-27 Published:2026-04-27

摘要: 声流控芯片技术广泛应用于生物医学、环境监测等领域,其典型应用场景是微颗粒分离。聚二甲基硅氧烷微流道和铌酸锂谐振器的异质集成键合是制造声流控芯片的关键技术,其核心挑战在于解决键合强度不足导致的界面处液体泄漏问题。为此,利用高等离子体密度的微波等离子体源替代传统射频源,实现了聚二甲基硅氧烷与铌酸锂之间的高强度等离子体活化键合。泄漏测试表明,基于上述技术制备的声流控芯片的最大流量提升125 %,达到270 μL/min,这为实现声流控芯片的高流量操作奠定了关键基础。进一步,基于该声流控芯片构建声流控微颗粒精准分离系统。该系统成功分离直径为3 μm和5 μm的聚苯乙烯微球,分离效率分别达79.4 %和89.5 %。

关键词: 声表面波, 微流控技术, 等离子体活化键合, 聚二甲基硅氧烷, 铌酸锂

Abstract: Acoustofluidic chip technology finds extensive applications in biomedicine, environmental monitoring, and other fields, with microparticle separation representing a primary use case. A key fabrication approach for such chips involves the heterogeneous integration of polydimethylsiloxane (PDMS) microchannels and lithium niobate resonators. However, the core challenge is overcoming liquid leakage at the interface resulting from inadequate bond strength. To this end, conventional radio-frequency plasma source was substituted with high-density microwave source, which enabled high-trength plasma-activated bonding between PDMS and lithium niobate. Leakage tests demonstrated that the maximum flow rate of the fabricated acoustofluidic chip increased by 125%, reaching 270 µL/min. This establishes a critical foundation for high-throughput operation in acoustofluidic devices. Furthermore, the integration of fluid handling, thermal control, electrical actuation, and imaging modules with the chip enabled the creation of a precision acoustofluidic system for microparticle separation. The system was employed to successfully separate polystyrene microparticles of 3 µm and 5 µm diameters, achieving separation efficiencies of 79.4% and 89.5%, respectively.

Key words: surface acoustic wave, microfluidic technology, plasma-activated bonding, polydimethylsiloxane, lithium niobate