表面贴装塑封芯片Die-EMC界面分层失效机理及制程优化研究
徐爱, 孟强, 许勇杨, 刘锦松
Delamination Failure Mechanism and Process
Optimization of Die-EMC Interface for Surface Mount Plastic Encapsulated Chip
XU Ai, MENG Qiang, Xu Yongyang, Liu Jinsong
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2027.0019
