基于铜互连微结构调控的混合键合技术研究进展
潘兴亚1, 师璐2, 梁兆蓝1, 黄文峰1, 仲艳3, 吴蕴雯1, 3, 曾小勤1
Research Progress on Hybrid Bonding Technology Based on Microstructure Engineering of Copper Interconnects
PAN Xingya1, SHI Lu2, LIANG Zhaolan1, HUANG Wenfeng1, ZHONG Yan3, WU Yunwen1, 3, ZENG Xiaoqin1
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2026.0148
