关键词: 混合键合, 铜互连, 微结构调控, 纳米孪晶铜, 表面处理

Abstract: With the rapid advancement of integrated circuits and advanced packaging technologies, hybrid bonding has emerged as a key enabler for extending beyond Moore’s Law, owing to its significant advantages in achieving high-density interconnects, low signal delay, and low power consumption. However, realizing high-quality copper-to-copper bonding under a low thermal budget still requires overcoming challenges such as interfacial voids, oxidation, and insufficient diffusion at low temperatures. Recent research progress in surface treatment and microstructure engineering of copper interconnects for hybrid bonding is systematically reviewed, and the development trends toward achieving low-temperature, reliable hybrid bonding are discussed, aiming to provide theoretical reference and technical support for the future research and application of high-density interconnect technologies.

Key words: hybrid bonding, copper interconnect, microstructure control, nanotwinned copper, surface treatment