Sn3.0Ag0.5Cu BGA焊点电迁移微观组织演变与失效模式
孟帅1, 刘厚麟1, 黄斐斐2, 黄明亮1
Microstructure
Evolution and Failure Mode of Sn3.0Ag0.5Cu BGA Solder Joints Under
Electromigration
MENG Shuai1, LIU Houlin1, HUANG Feifei2, HUANG Mingliang1
电子与封装
.
0, (): 0
-0
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DOI: 10.16257/j.cnki.1681-1070.2027.0035
