基于种子层缺陷的玻璃通孔机械可靠性分析
陈明诚1, 李文磊1, 张继华1, 陈宏伟1, 高莉彬1, 王苗1, 李梦茹1, 王冬滨2, 刘婷2
Mechanical
Reliability Analysis of Through Glass Via Based on Seed Layer Defects
CHEN Mingcheng1, LI Wenlei1, ZHANG Jihua1, CHEN Hongwei, GAO Libin, WANG Miao1, LI Mengru1, WANG Dongbin2, LIU Ting2
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2026.0111
