关键词: 玻璃通孔, 种子层, 缺陷, 能量释放率, 机械可靠性

Abstract: Simulation studies on the energy release rate at interfaces were conducted to investigate the influence of seed layer defects on metal-glass interface delamination behavior during through glass via (TGV) metallization. Based on a TGV structural model incorporating seed layer defects and interface cracks, the finite element method was employed with the introduction of the J-integral to quantitatively characterize the delamination driving force. The study systematically analyzed the influence patterns of defect size, via geometric parameters, and the metal-glass material system on the steady-state energy release rate. Results indicate that the energy release rate of seed layer defects gradually increases with defect height before reaching a steady state, with the steady-state value directly correlating to defect width. Concurrently, enlarging the TGV aperture significantly enhances the steady-state energy release rate. Comparative studies of steady-state energy release rates across different metal-glass material systems reveal that reducing thermal expansion mismatch between metal and glass while appropriately lowering the Young's modulus of the metal material helps diminish interfacial delamination driving forces. This study provides a mechanical basis for evaluating interface reliability and optimizing designs in glass-based packaging.

Key words: through glass via, seed layer, defect, energy release rate, mechanical reliability