大尺寸超薄碳化硅晶圆制备技术研究及其先进封装应用
喻志奎, 朱一新, 万青
Research on Preparation Technology of Large-Size
Ultra-Thin Silicon Carbide Wafers and Its Application in Advanced Packaging
YU Zhikui, ZHU Yixin, WAN Qing
电子与封装
.
0, (): 0
-0
.
DOI: 10.16257/j.cnki.1681-1070.2026.0157
