金凸点的植球过程及其形貌影响因素分析
易双秦, 朱晨俊, 张未希, 常文涵, 张家明
Analysis on Ball Bonding Process and Morphology
Influencing Factors of Gold Bumps
YI Shuangqin, ZHU Chenjun, ZHANG Weixi, CHANG Wenhan, ZHANG Jiaming
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2027.0053
