关键词: 金凸点, 打火参数, 焊接压力, 超声功率, 超声时间

Abstract: Gold bumps are critical interconnection structures for flip chip bonding, and their morphology directly affects chip interconnection reliability. To achieve gold bump morphology control, this study systematically investigates the effects of process parameters on the gold bump ball bonding process and morphology. The gold bump forming mechanism is analyzed based on ball bonding principles. Process experiments are conducted using the control variable method, and linear fitting is adopted to explore the influences of ignition parameters and bonding parameters (bonding pressure, ultrasonic power, ultrasonic time) on gold bump volume and shape. The results show that gold bump volume is positively correlated with ignition parameters. Bonding parameters are linearly correlated with bump shape and dimensions. Bonding pressure and ultrasonic power are the dominant influencing factors, while ultrasonic time has a relatively weak effect. Reasonable value ranges of key process parameters are determined based on gold bump morphology variation. Dimensional fitting formulas are established via multiple linear fitting. Experimental verification proves the formulas have small errors and good applicability within the set parameter range. This work provides theoretical support for parameter optimization and morphology control of flip-chip gold bump forming processes.

Key words: gold bumps, ignition parameters, bonding pressure, ultrasonic power, ultrasonic time