基于垂直电镀设备的铜凸块电沉积多物理场仿真与实验研究
张浩1, 2, 訚耀保1, 毛超威2
Multiphysics Simulation and Experimental Study
of Copper Pillar Bump Electrodeposition Based on Vertical Plating System
ZHANG Hao1, 2, YIN Yaobao1, MAO Chaowei2
电子与封装
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DOI: 10.16257/j.cnki.1681-1070.2026.0160
