倒装芯片技术的核心工艺及发展脉络
陈伶俐1, 胡立雪1, 廖希异1, 何万波1, 李艳琼1, 李曦頔1, 贺从勇2
Development Trajectory and Core Processes of
Flip-Chip Technology
CHEN Lingli1, HU Lixue1, LIAO Xiyi1, HE Wanbo1, LI Yanqiong1, LI Xidi1, HE Congyong2
电子与封装
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0, (): 0
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DOI: 10.16257/j.cnki.1681-1070.2027.0059
