关键词: 倒装芯片, 先进封装, 系统级集成, 堆叠封装, 凸点制作

Abstract: Flip-chip technology, as a core supporting technology for advanced microelectronic packaging, runs through two main threads: the innovation of bump fabrication processes and the evolution of system-level heterogeneous integration. This paper systematically reviews the process iteration of flip-chip bump technology, clarifying the technical principles and fabrication process of bump forming technologies such as printing, electroplating and evaporation. It also discusses the assembly and underfill methods for flip-chip packaging, conducts an in-depth analysis of the integration strategies and prospects the future development trends of flip-chip in the field of advanced packaging. Thus, it provides theoretical reference and technical guidance for the process optimization and industrial application of flip-chip technology.

Key words: flip-chip, advanced packaging, system-level integration, stacked packaging, bump fabrication