结晶硅微粉对KBJ元器件封装用EMC气孔的影响
张未浩，谢广超，于轩，丁全青，陈波
The Effect of Crystalline Silicon Powder on the Void of EMC Encapsulation in KBJ Device Package
ZHANG Weihao,XIE Guangchao,YU Xuan,DING Quanqing,CHEN Bo
电子与封装
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2018, (1): 5
-7
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DOI: 10.16257/j.cnki.1681-1070.2018.0002
