晶圆减薄表面损伤层对断裂强度影响的研究
冯小成，李 峰，李洪剑，荆林晓，贺晋春，井立鹏
Study on the Effect of Surface Damage Layer on Fracture Strength after Wafer Thinning
FENG Xiaocheng, LI Feng, LI Hongjian, JING Linxiao, HE Jinchun, JING Lipeng
电子与封装
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2018, (10): 4
-8
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DOI: 10.16257/j.cnki.1681-1070.2018.0106
