关键词: 晶圆, 机械磨削, 损伤层, 断裂强度

Abstract: The paper introduces the principle, process and the risk of thinning of wafer mechanical grinding, analysis the influencing factors of surface damage layer thickness after wafer thinning, and studies the relationship between damage layer thickness and wafer fracture strength. The results show that :within a certain range, selecting the large number of grinding wheels, increasing the speed and reducing the feed rate of the spindle can effectively reduce the thickness of the damaged layer of the processing surface after wafer thinning .The smaller the thickness of the damaged layer is , the higher the fracture strength is. Finally, we get the optimized mechanical grinding and thinning process, thereby improving the fracture strength of the wafer after thinning by mechanical grinding, reducing the probability of the wafer fragmentation , and improving the reliability of chip packaging.

Key words: wafer, mechanical grinding, damage layer, fracture strength