中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2017, Vol. 17 ›› Issue (8): 1 -4. doi: 10.16257/j.cnki.1681-1070.2017.0092

• 封装、组装与测试 •    下一篇

大电流键合金丝熔断能力模拟分析

曹小鸽,徐微   

  1. 西安交通大学城市学院,电气与信息工程系,西安 710018
  • 出版日期:2017-08-20 发布日期:2017-08-20
  • 作者简介:曹小鸽(1984—),女,河南许昌人,硕士学历,讲师,研究方向为半导体激光器的封装工艺
  • 基金资助:
    西安交通大学城市学院校内科研基金项目(2015KZ12)

Simulation Analysis of Fusing Capacity of High Current Bonding Gold Wire

CAO Xiaoge, XU Wei   

  1. Xi’an Jiaotong University City College, Department of Electrical and Information Engineering, Xi’an 710018, China
  • Online:2017-08-20 Published:2017-08-20

摘要: 光纤通信用半导体激光器正朝着微型化、集成化方向飞速发展。激光器的集成化会产生大量的热量,为保证激光器的正常工作,就需要用制冷器来控制温升。当激光器通过金丝给制冷器供电时,金丝必须能持续通过几安培的直流电流而不至于熔断,所以金丝的热分析及热熔断实验就非常有必要。在金丝熔断电流理论分析的基础上利用ANSYS软件对金丝进行热模拟分析,并经过实验验证找出2.0 mm金丝工作时的熔断电流,对制冷型激光器的研制有直接指导意义。

关键词: 金丝, 热分析, ANSYS

Abstract: Semiconductor lasers for fiber-optic communication are now developing fast along the direction of miniaturization and integration. The integration of laser device generates a lot of heat, and a refrigerator is required to control the temperature. When gold wire is used to power the refrigerator, it must be able to allow a few Amperes of direct current to flow through without fusing. In this case, thermal analysis and fusing experiments of the gold wire are very necessary. In the paper, based on the theoretical analysis of fusing current in gold wire, ANSYS software is used to perform thermal analysis of gold wire and the fusing current of 2.0 mm gold wire is found. The results have direct guiding significance for the development of the cooled laser.

Key words: gold wire, thermal analysis, ANSYS

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