关键词: 一体化引线, 合金烧结, 封装结构, 封装工艺

Abstract: Optimization of structure and process design has become an indispensable step in packaging.With the detector size of the package is more and more small,reliability requirements continue to increase,the hermetic package to the surface mount,ultra-thin,chip and package area ratio higher conversion,package structure and packaging process design Become the key to reliability,yield and cost.To ride a straddle patch semiconductor radiation detectors in the package,there are the die bonding substrate,sealing ring,pin and ceramic pieces had Ag72Cu28 brazing solder accumulation,crawling,and die Au80Sn20 welding layer holes bigand given to filter through Radiographyor Ultrasonic Inspection weed out the unqualified products,analysis the reason and by optimizing the structure,improve the packaging process to solve the quality and reliability.The actual production results show that the structure optimization and process improvement effectivelysimplify the shell structure and reduce the manufacturing process steps,and improve the chip sintering quality and yield,reduce the cost.

Key words: pin integration, alloy soldering, package structure, packaging process