中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2020, Vol. 20 ›› Issue (10): 100402 . doi: 10.16257/j.cnki.1681-1070.2020.1007

• 微电子制造与可靠性 • 上一篇    下一篇

热流罩对军用电子产品高低温摸底测试的价值

王燕婷;莫国成;印琴   

  1. 中科芯集成电路有限公司,江苏 无锡 214072
  • 收稿日期:2020-04-02 发布日期:2020-05-26
  • 作者简介:王燕婷(1986—),女,江苏无锡人,本科,工程师,主要从事标准化相关工作。

Value of Heat FlowHood to the Bottom Test of Military Electronic Products at High and Low Temperature

WANG Yanting, MO Guocheng, YIN Qin   

  1. China Key System & IntegratedCircuit Co., Ltd.,Wuxi 214072, China
  • Received:2020-04-02 Published:2020-05-26

摘要: 基于军方应用电子产品的极端环境,介绍了采用热流罩测试的摸底价值。基于热流罩完全罩住被测器件,并持久保持在设定极限温度点,器件在极端环境温度下进行通电测试,可更准确地反映产品在极端环境下的真实特性。通过用热流罩和现行的烘箱测试方法对运算放大器进行对比测试来进一步论证其准确性。该测试方法为军用电子产品在高低温测试摸底提供了参考价值。

关键词: 单片集成电路, 热流罩, 高低温测试

Abstract: The value of heat flow hood test is introduced based on the extreme environment of military application electronic products. The cover is fully set on the tested queue and keeps the device at the set limit temperature point for a long time to conduct the general application test, it can more accurately reflect the direct and real characteristics of the product under the extreme environment. In this paper, the accuracy of the operational amplifier is further demonstrated by comparing the operational amplifier with the hot equipment and the current box test method. Test methods provide participants for military electronic products in high and low mix test.

Key words: monolithic integrated circuit, heatshield oven, high and low temperature test

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