中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2021, Vol. 21 ›› Issue (1): 010401 . doi: 10.16257/j.cnki.1681-1070.2021.0109

• 微电子制造与可靠性 • 上一篇    下一篇

智能功率模块中绝缘铝基板可靠性提升设计研究

党宁,潘效飞,龚平   

  1. 无锡华润安盛科技有限公司,江苏 无锡 214028
  • 收稿日期:2020-06-22 出版日期:2021-01-20 发布日期:2020-09-02
  • 作者简介:党宁(1994—),男,江苏无锡人,本科,工程师,现从事智能功率模块封装开发与研究工作。

Design andResearch on Reliability Improvement of Insulated Aluminum Substrate inIntelligent Power Module

DANG Ning, Pan Xiaofei, Gong Ping   

  1. Wuxi ChinaResources Micro-assembly Technology Co., LTD, Wuxi 214028,China
  • Received:2020-06-22 Online:2021-01-20 Published:2020-09-02

摘要: 近年来,家用电器的变频功能逐渐成为其市场竞争中的主要技术卖点之一。智能功率模块作为白色家电的核心器件,降低热阻和提升耐压作为两项最重要的封装评估项目愈发受到设计者的重视。以铝基板为载板的功率模块作为介绍对象,从其各介层的结构和工艺处理方式等方面入手,解决铝基板在实际生产中遇到的绝缘层开裂引发的可靠性问题。

关键词: 智能功率器件, 铝层, 绝缘层, 玻璃纤维, 填充料, 布线层设计

Abstract: In recent years, the inverter function of household appliances has become one of the main technical selling points in their market competition. As the core device of white household appliances, the intelligent power module, whose reduction of thermal resistance and enhancement of voltage-withstand as the two most important evaluation projects in Assy, has attracted more and more attention of designers. In this paper, the power module of aluminum substrate is introduced, and the reliability problems caused by the cracking of insulating layer in the actual production of aluminum substrate are solved from the aspects of the structure and process treatment of each dielectric layer.

Key words: intelligentpowerdevice, aluminumlayer, insulatinglayer, glassfiber, filler, wiringlayerdesign

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