电子器件自毁技术

doi:10.16257/j.cnki.1681-1070.2021.0604

电子与封装 ›› 2021, Vol. 21 ›› Issue (6): 060406 . doi: 10.16257/j.cnki.1681-1070.2021.0604

电子器件自毁技术

周立彦;朱思雄;王剑峰

中国电子科技集团公司第五十八研究所，江苏无锡　214072

收稿日期:2020-11-20 出版日期:2021-06-23 发布日期:2021-01-20
作者简介:周立彦（1991—），男，江苏张家港人，博士，工程师，现从事先进封装工艺开发及设计仿真工作。

Self-Destructing Methods for Electronics

ZHOU Liyan, ZHU Sixiong, WANG Jianfeng

China Electronics Technology Group CorporationNo.58 Research Institute, Wuxi 214072, China

Received:2020-11-20 Online:2021-06-23 Published:2021-01-20

摘要/Abstract

摘要： 电子器件存储信息及其核心制造工艺的安全防护至关重要，而对器件实施物理毁坏是最彻底的防护方法。介绍了不同类型的电子器件自毁技术，包括可降解瞬态电子技术、应力破坏、化学腐蚀以及含能材料热毁伤，对不同类型自毁技术的适用性和局限性进行了论述和比较，阐述了电子器件自毁技术的发展前景。

关键词: 器件自毁, 瞬态电子, 应力破坏, 化学腐蚀, 含能材料

Abstract: Physical destruction to electronics is the most thorough protection method for the security of information storage, as well as the core manufacturing technologies. This paper introduces different types of self-destructing approaches for electronic devices, including degradable transient electronics, mechanical shattering, chemical corrosion and energetic attacks, discusses and compares the applicability and limitations, and expounds the development prospect of these different self-destructing methods.

Key words: self-destructing, transientelectronics, mechanicalshattering, chemicalcorrosion, energeticmaterials

中图分类号:

TN409

周立彦;朱思雄;王剑峰. 电子器件自毁技术[J]. 电子与封装, 2021, 21(6): 060406 .

ZHOU Liyan, ZHU Sixiong, WANG Jianfeng. Self-Destructing Methods for Electronics[J]. Electronics & Packaging, 2021, 21(6): 060406 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

电子器件自毁技术

Self-Destructing Methods for Electronics

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