关键词: ?超声键合, 剪切力, 单因子, 正交试验

Abstract: As the key process of chip packaging, the quality of wire bonding directly affects the performance of the device. Generally, thick aluminum wire is used in ultrasonic wedge bonding for power devices. In this paper, technical parameters of the first bond and the second bond on the chip were systematically studied and shear force were used as a method to measure bonding quality. Effect of technical parameters on bonding strength was analyzed with single factor analysis. The optimal parameter was determinated and the differences between the two types of bonds were compared with orthogonal experiment method, which providing a reference for setting parameters of wire bonding in this field.

Key words: ultrasonicbonding, shearforce, singlefactor, orthogonalexperiment