中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2022, Vol. 22 ›› Issue (1): 010207 . doi: 10.16257/j.cnki.1681-1070.2022.0112

• 封装、组装与测试 • 上一篇    下一篇

微波组件裸芯片开裂的机理分析

李庆   

  1. 四创电子股份有限公司,合肥 230088
  • 收稿日期:2021-05-18 出版日期:2022-01-25 发布日期:2021-09-15
  • 作者简介:李庆(1984—),男,安徽芜湖人,本科,工程师,现从事微波混合集成电路微组装工艺研究。

Analysis of Cracking Mechanism of Microwave Module BareChip

LI Qing   

  1. Sichuang Electronics Co., Ltd., Hefei 230088, China
  • Received:2021-05-18 Online:2022-01-25 Published:2021-09-15

摘要: 针对微波组件壳体内部裸芯片出现不同程度裂纹的现象,从微波组件的工艺材料、工装设计、装配工艺过程、试验过程等逐一进行机理分析,找出了微波组件内部裸芯片开裂的真正原因。并提出了类似于该微波组件的结构在试验安装方面的控制要点。

关键词: 工装, 筛选试验, 热膨胀系数

Abstract: There are different degrees of cracks in the bare chip inside the shell of the microwave component. The mechanisms of the process materials, tooling design, assembly process and test process of the microwave module are analyzed one by one, and finds out the real reason for the cracking of the bare chip inside the microwave module. The structure similar to the microwave module and the control points in the test and installation are put forward.

Key words: fixture, screeningtest, coefficientofthermalexpansion

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