关键词: FBAR滤波器, 晶圆制造, 图形化, 斜坡形貌

Abstract: The bottom electrode graphic technology，a key technology in wafer manufacturing process of the thin film bulk acoustic resonator (FBAR) filters, is studied. By optimizing the focal plane and exposure amount in the photolithography process, the glue figure with an angle of about 50° is produced. At the same time, the process parameters of the dry etching equipment are adjusted, and the slope structure of the bottom electrode sidewall with an angle of 10.91° are realized, which lays a foundation for the chip manufacturing process of the FBAR filters.

Key words: FBAR filter, wafer manufacturing, graphic, slope structure