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中国电子学会电子制造与封装技术分会会刊

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• 封装、组装与测试 •    下一篇

某MEMS垂直探针在针测行程作用下的屈曲力学行为研究

秦林肖   

  1. 强一半导体(苏州)股份有限公司
  • 收稿日期:2024-10-07 修回日期:2025-01-06 出版日期:2025-01-20 发布日期:2025-01-20
  • 通讯作者: 秦林肖

Research on Buckling Properties of one MEMS Vertical Probe under Overdrive Displacement

QIN Linxiao   

  1. Maxone Semiconductor (Suzhou)Co., Ltd, Suzhou Jiangsu, China 21500
  • Received:2024-10-07 Revised:2025-01-06 Online:2025-01-20 Published:2025-01-20

摘要: 探针卡作为一种测试接口,是连接芯片和测试机之间的中间媒介,而其中晶圆测试中所用的探针是测试机与晶圆上被测芯片之间进行通信的重要功能部件。基于我司研制的某规格MEMS垂直探针,采用有限元分析软件,对比分析5根与所配合装配的PH上下盖板的初始接触状态不同的探针在同样的针测行程作用下各个探针的关键力学性。并基于屈曲理论,采用拟合方法推导探针接触力BCF与所加载针测行程OD之间的函数关系式。

关键词: 探针卡, MEMS垂直探针, 有限元分析, 针测行程, 接触力BCF

Abstract: Probe Card, as a test interface is the intermediate medium between the chip and the test machine, and the probe used in wafer testing is an important component of the communication between the tester and the tested chip on the wafer. Based on one type of MEMS vertical probe developed by our company, compare and analyze the key mechanical properties of 5 probes with different initial contact states between the upper guide plate and the lower guide plate of the probe head (PH) under the same OD displacement by finite element analysis software. Based on the buckling theory, the function relation between BCF and OD was derived by fitting method.

Key words: probe card, MEMS vertical probe, finite element analysis, over drive displacement, balance contact force