中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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• 封装、组装与测试 •    下一篇

基于SiP微系统的DSP微组件测试方法研究

赵桦,朱江,宋国栋,张凯虹,奚留华   

  1. 中国电子科技集团公司第五十八研究所,江苏 无锡  214035
  • 收稿日期:2024-10-18 修回日期:2025-01-01 出版日期:2025-01-20 发布日期:2025-01-20
  • 通讯作者: 赵桦

Research on Test Method of DSP Microcomponents Based on SiP Microsystem

ZHAO Hua, ZHU Jiang, SONG Guodong, ZHANG Kaihong, XI Liuhua   

  1. China Electronics Technology Group Corporation No.58 Research Institute, Wuxi 214035, China
  • Received:2024-10-18 Revised:2025-01-01 Online:2025-01-20 Published:2025-01-20

摘要: SiP微系统是一种高度集成化的系统,其内部集成了一个或多个数字信号处理(DSP)芯片、Nor Flash、DDR3存储器和AI加速芯片等,复杂的SiP微系统还集成了FPGA芯片。由于内部集成了多个微组件且芯片之间相互连接,传统的测试单一微组件的方法并不适用于SiP微系统。提出了针对DSP微组件测试方法,该系统包括一块专门的测试板、可调试的电脑测试环境和联合测试行动小组(JTAG)接口。与单一的DSP芯片测试相比,它可以快速、稳定地实现对DSP微组件的性能测试,满足大批量生产测试的需求。

关键词: SIP微系统, DSP微组件, 大批量生产

Abstract: A SiP microsystem is a highly integrated system that integrates one or more digital signal processing (DSP) chips, Nor Flash, DDR3 memory, and AI acceleration chips, the complex SiP microsystem also integrates FPGA chips. Due to the internal integration of multiple microcomponents and the interconnection between the chips, the traditional method of test a single microcomponent is not suitable for SiP microsystems. A test methodology is proposed for DSP microcomponents, which includes a dedicated test board, a debuggable computer test environment, and a joint test action group (JTAG) interface. Compared with a single DSP chip test, it can realize the performance test of DSP microcomponents quickly and stably, and meet the needs of mass production test.

Key words: SIP microsystem, DSP microkits, mass production