关键词: 半导体塑封器件, 内部结构, 空洞, 良率

Abstract: Semiconductor plastic encapsulated integrated circuit, with their distinct advantages in cost efficiency and lightweight properties, have become indispensable in high-reliability applications such as aerospace, driven by the evolving demands of modern technology. However, concerns regarding product yield and reliability associated with molding voids have garnered significant attention. A well-optimized internal structural is pivotal for mitigating the occurrence of voids during the molding process. This study systematically examines the influence of various internal structural designs on void formation in encapsulated devices. The findings demonstrate that altering the molding direction alone does not effectively reduce void occurrence. Conversely, increasing the area and volume proportions of internal components substantially decreases the probability of void formation and, in some cases, completely eliminates it. This improvement is attributed to enhanced flow stability, temperature uniformity, and material filling during the molding process. The insights provided by this research offer valuable guidance for the structural design of encapsulated devices, facilitating fewer prototyping iterations, shorter development cycles, and improved product yield and reliability.

Key words: Semiconductor plastic encapsulated integrated circuit, internal structure, molding voids, yield rate