关键词: 共烧陶瓷基板, 界面, 微裂纹, 微空洞

Abstract: The low temperature co-fired ceramic multilayer substrate with cavities and metal through holes is a heterogeneous material system, and there are multiple interfaces in the substrate. The substrate cavity interface and the metal via layer interface are two typical interfaces. The problems of micro-cracks and micro-cavities appeared in the substrate cavity interface and the interface between metal via layers respectively in the substrate manufacturing process are studied. Through finite element simulation analysis and destructive physical analysis, the reasons for the formation of micro-cracks in the cavity interface and micro-voids in the interface between metal vias are discussed, and targeted process improvement measures are taken. The results show that through process improvement, interface micro-cracks and interlayer micro-void defects can be better suppressed.

Key words: co-firedceramicsubstrate, interface, micro-crack, micro-void